Suriya Ramalingam

About Suriya Ramalingam

I am a seasoned professional with 18+ years of product engineering and production management experience in diverse sectors. Recognized for demonstrating a natural aptitude for project management, as well as for prototype design and team leadership, I have a verifiable history of contributing directly to company growth and success throughout my career. Professional focal points include polymer science, product integration, risk analysis, solutions development, team collaboration, people management, critical thinking, and best practices. Delivering superior administration on the latter areas of expertise requires utilization of effective communication and prioritization skills, as well as problem solving, process optimization, strategic planning, and resource management to support efficiency and maximum returns. Currently, I am an Engineering Area Manager with Intel. In this role, I utilize strong knowledge and experience in encapsulation process development in relation to microchip assembly while delivering superior quality mobile chipsets in 14 and 10nm packaging through diligent leadership and collaboration. I also direct and oversee a broad range of engineering tasks in the areas of equipment, materials, manufacturing, and upstream processes. In addition, I liaise with senior leadership, stakeholders, and cross-functional teams to ensure the company’s product support structure is driving the business forward with minimal expenditures.Colleagues describe me as a progressive, driven, down-to-earth, engineering and managerial expert who can be relied on to offer superior solutions that deliver profitable results on time and under budget.I am interested in contacting former colleagues and managers, as well as other professionals in my field. Feel free to contact me through this profile if you wish to connect.

Experience

1. Engineering Area Manager (2nd Level Manager of 50 People Organization)

   Intel

   May 2023 — Present · Hillsboro, OR, US

   Demonstrated Strategic leadership in executing 24 X 7 Factory operational excellence with equipment maintenance, continuous capacity assessment and improvements, resource management, onboarding and training for factory operational skills.•Demonstrate achievements as a strategic and technical leader in assessing the current and future needs of engineering team and planning priorities, headcount, assignments and roadmaps self-sufficiently.•Building and managing strong relationships with all stakeholders- Manufacturing, Materials team, Global supply chain, reliability & quality team, Integration groups and establishing strategy to support flawless execution in Wafer Level Assembly.•Delivering World Class stacked die technology “Foveros” through two of the key modules, Wafer encapsulation and Glass carrier bond-debond processes.•Recognized as one of the finalist of 6 on “2023 Manager Excellence Award” at TMG/Intel organization level.

Education

• Pondicherry University

  Master's degree, Chemical Sciences/Chemistry

  2000 — 2002

• Bharathidasan Govt. College for Women

  Bachelor's degree, Chemistry

  1997 — 2000

• University of Massachusetts Amherst

  PhD

  2004 — 2009

Skills

• Materials Science
• Science
• Characterization
• Spectroscopy
• Thin Films
• Afm
• Scanning Electron Microscopy