Sudan Ahmed
Sr. Staff IC Packaging Engineer at Renesas Electronics America
- Role
- Sr Staff Ic Packaging Engineer at Renesas Electronics
- Location
- Austin, TX, US
- LinkedIn followers
- 500 followers
About Sudan Ahmed
12+ years of experience in IC packaging area.• 6 years of experience of leading package development (NPI), from initial concept to production, to establish cost effective and reliable solutions that meets assembly design rule and project schedule.• 1st hand experience of working with SiP, QFN, BGA, flip chip, WLCSP etc. packages.• Working in cross-functional team: marketing, PE/TE, chip & package design, QA/reliability, OSATs etc.• 6 years of research experience in mechanical testing and microstructure study of different materials for microelectronic applications.• Experienced in failure analysis technique: cross-sectioning, polishing, optical microscopy, scanning electron microscopy, EDS etc. and familiar with X-ray, focused ion beam (FIB), and TEM techniques. • Familiar with SMT process, thermal cycling, shock/ drop/vibration testing, Weibull plot etc.• Skilled in mechanical stress testing, environmental testing, and FEA modeling for reliability prediction. • Designed and conducted several experiments including in-situ evaluation of microstructural changes during high-temperature storage.• 4+ years of experience of teaching SolidWorks and MATLAB to undergraduate students.• Have a strong background in Metallurgy and Materials Engineering.• Skilled in data analysis and presentation using MATLAB, Excel and Sigma Plot. ANALYTICAL SKILLSSoftware: MATLAB, SolidWorks, ANSYS, Microsoft Excel, Sigma Plot, ImageJ, AutoCAD, NX, R, MinitabMechanical Testing: Nanoindentation (Hysitron TI 950, MTS Nanoindenter XP), Tensile, Creep, Fatigue (MT 200 thermo-mechanical test system, MTS, and Instron Testing systems)Imaging: Optical Microscope (Olympus and Zeiss), Scanning Electron Microscope (JEOL and Zeiss), EDSSample Preparation: Reflow oven (Heller 1800EXL), Cross sectioning (IsoMet Polishing, Sputtering, 3D PrintingThermal Analysis: DSC, DMA, TGA, TMAMy contact info:s•••••••@gmail.com
Experience
Sr Staff Ic Packaging Engineer
Apr 2026 — Present · Austin, TX, US
Education
Tuskegee University
Master of Science (M.Sc.), Mechanical Engineering
2011 — 2013
Auburn University
Doctor of Philosophy (PhD), Mechanical Engineering
2013 — 2018
Bangladesh University of Engineering and Technology
Bachelor of Science (B.Sc.), Materials and Metallurgical Engineering
2003 — 2008
Skills
- Solidworks
- Nanoindentation
- Autocad
- Engineering
- Personal Development
- Time Management
- Xrd
- Matlab
- Thermal Analysis
- Microsoft Office
- Tma
- Dma
- Microsoft Excel
- Composites
- Nx 7.5
- Differential Scanning Calorimetry
- Mechanical Engineering
- Optical Microscopy
- Characterization
- Mechanical Characterizations of Materials
- Materials Science
- Labview
- Finite Element Analysis
- Nanotechnology
- Scanning Probe Microscopy
- Nde
- Manufacturing
- Life Skills
- Mechanical Testing of Materials
- Ansys
- Scanning Electron Microscopy
- Metallography
- Tga
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