Sudan Ahmed

Sr. Staff IC Packaging Engineer at Renesas Electronics America

Role
Sr Staff Ic Packaging Engineer at Renesas Electronics
Location
Austin, TX, US
LinkedIn followers
500 followers

About Sudan Ahmed

12+ years of experience in IC packaging area.• 6 years of experience of leading package development (NPI), from initial concept to production, to establish cost effective and reliable solutions that meets assembly design rule and project schedule.• 1st hand experience of working with SiP, QFN, BGA, flip chip, WLCSP etc. packages.• Working in cross-functional team: marketing, PE/TE, chip & package design, QA/reliability, OSATs etc.• 6 years of research experience in mechanical testing and microstructure study of different materials for microelectronic applications.• Experienced in failure analysis technique: cross-sectioning, polishing, optical microscopy, scanning electron microscopy, EDS etc. and familiar with X-ray, focused ion beam (FIB), and TEM techniques. • Familiar with SMT process, thermal cycling, shock/ drop/vibration testing, Weibull plot etc.• Skilled in mechanical stress testing, environmental testing, and FEA modeling for reliability prediction. • Designed and conducted several experiments including in-situ evaluation of microstructural changes during high-temperature storage.• 4+ years of experience of teaching SolidWorks and MATLAB to undergraduate students.• Have a strong background in Metallurgy and Materials Engineering.• Skilled in data analysis and presentation using MATLAB, Excel and Sigma Plot. ANALYTICAL SKILLSSoftware: MATLAB, SolidWorks, ANSYS, Microsoft Excel, Sigma Plot, ImageJ, AutoCAD, NX, R, MinitabMechanical Testing: Nanoindentation (Hysitron TI 950, MTS Nanoindenter XP), Tensile, Creep, Fatigue (MT 200 thermo-mechanical test system, MTS, and Instron Testing systems)Imaging: Optical Microscope (Olympus and Zeiss), Scanning Electron Microscope (JEOL and Zeiss), EDSSample Preparation: Reflow oven (Heller 1800EXL), Cross sectioning (IsoMet Polishing, Sputtering, 3D PrintingThermal Analysis: DSC, DMA, TGA, TMAMy contact info:s•••••••@gmail.com

Experience

  1. Sr Staff Ic Packaging Engineer

    Renesas Electronics

    Apr 2026 — Present · Austin, TX, US

Education

  • Tuskegee University

    Master of Science (M.Sc.), Mechanical Engineering

    2011 — 2013

  • Auburn University

    Doctor of Philosophy (PhD), Mechanical Engineering

    2013 — 2018

  • Bangladesh University of Engineering and Technology

    Bachelor of Science (B.Sc.), Materials and Metallurgical Engineering

    2003 — 2008

Skills

  • Solidworks
  • Nanoindentation
  • Autocad
  • Engineering
  • Personal Development
  • Time Management
  • Xrd
  • Matlab
  • Thermal Analysis
  • Microsoft Office
  • Tma
  • Dma
  • Microsoft Excel
  • Composites
  • Nx 7.5
  • Differential Scanning Calorimetry
  • Mechanical Engineering
  • Optical Microscopy
  • Characterization
  • Mechanical Characterizations of Materials
  • Materials Science
  • Labview
  • Finite Element Analysis
  • Nanotechnology
  • Scanning Probe Microscopy
  • Nde
  • Manufacturing
  • Life Skills
  • Mechanical Testing of Materials
  • Ansys
  • Scanning Electron Microscopy
  • Metallography
  • Tga

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Sudan Ahmed — Sr Staff Ic Packaging Engineer at Renesas Electronics in Austin, TX, US | Unifers