Subrahmanya Pradeep Morusupalli
Chip-package-board Signal and Power Integrity Lead @Renesas Electronics
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WORK HISTORY
Chip-package-board Signal and Power Integrity Lead @Renesas Electronics
Hyderabad, IN
EDUCATION
Texas A&M University
M.S., Microelectronics
Vanderbilt University
(Ph.D.), Solidstate Devices
SKILLS
ABOUT SUBRAHMANYA PRADEEP MORUSUPALLI
16 years of semiconductor industry and academic research experience of which13 years as DDR and High Speed Interface Signal Integrity and Power Integrity Analysis Engineer, 3 years of research experience focused on Device Physics. Worked as software engineer for 2 years in software programming. Active inventor and authored journal articles and in conference proceedings.Specialties: Channel simulations - Full system analysis IO-PKG-PCB-PKG-IODriving parameter sensitivity studies for segregated component and full system optimizationsPDN analysis and Co-SIPI analysis HSPICE for circuit transient analyses, ADS for time and FD analyses, AEDT for EM design. Ansys SIwave for model extractions.Also, developed FEM based physics models for 1D transport and electrostatics in nanomaterial channel based MOSFETS and MuGFETS using MATLAB.Device Modeling with TCAD (Sentaurus).
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