Subhash Joshi
Program Manager and Senior Principal Engineer at Intel
- Role
- Program Manager Intel 14a and Senior Principal Engineer at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
About Subhash Joshi
Created, developed, and grew large, inter-disciplinary teams that relied on each other.…
Experience
Program Manager Intel 14a and Senior Principal Engineer
May 2000 — Present · Portland, OR, US
Program manager, Intel 14A and 14A-E 02/2023 – present Manage technology definition. Track competitive landscape and customer feedback. Advocate and communicate to process and design teams. Drive execution of process development, PDKs, and testchips. Provide technical and logistical guidance to hit yield, performance, reliability, and cost goals. Engineering manager 10nm, Intel 7 & Intel 14A FEOL technology 11/2016 – 01/2023 Defined and executed strategic roadmaps for Intel 7. Core contributor towards historically robust defect reliability + world leading 6GHz frequency on RaptorLake desktop. Grew 14A FE team from Pathfinding to Development. Beat early yield and performance goals by multiple quarters while successfully integrating 2nd gen RibbonFET and 2nd gen PowerVia.Principal engineer 10nm technology 10/2012 – 10/2016 Executed complete revamp of Pmos Epi source-drain, foundational for Intel’s 10nm and later nodes. Delivered contact patterning/ silicide/ metals modules for industry-1st dual sal/ COAG yield & perf.Staff transistor integration engineer 22nm technology 10/2008 – 09/2012 Developed industry-1st self-aligned contact scheme and first ever Ti silicide at sub-micron nodes. Integrated industry-1st Pmos FinFET transistor with world-leading performance (Intel Achievement Award).Senior transistor integration engineer 45nm technology 11/2004 – 09/2008 Team leader in various phases for isolation, dual metal gate, and trench contact modules. Metal gate and trench contact modules were industry-1st; now standard in all leading techs.Senior silicon-package integration engineer 90nm technology – 10/2004 Developed laser scribe (Intel Achievement Award): crucial for Intel to lead industry in low-k CDO integration. Managed volume pilot of lead-free bumps at Intel, an industry-1st. Developed first wafer level thick metal redistribution layer at Intel, a mainstay of all advanced nodes from 45nm onwards.
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