Steve Payne

Project Manager @Inemi

Steve Payne is Project Manager for iNEMI and currently coordinates their collaborative Projects:\\\\n• “PCB & PCBA Material Characterization for Harsh Environments – Phase 1 (Automotive) & Phase 2”,\\\\n• “Best Practices for Expanded Beam Connectors in Data Centres – Phase 1 & Phase 2”,\\\\n• “Reliability & Loss Properties of Copper Foils for 5G Applications”\\\\n• “PCB Characterization for CAF and ECM Failure Mitigation”\\\\n• “Hybrid PCBs for Next Generation Applications”\\\\nIn addition, Steve manages the iNEMI Initiatives:\\\\n• “PCB Connector Footprint Tolerances\"\\\\n• “Liquid Immersion Cooling of PCB assemblies”\\\\nSteve also supports additional project proposals for “PCB Level Interconnect for Co-Packaged Optics” and “PCB Pad Cratering and Pad Lift Characterization and Mitigation”\\\\nSteve coordinates and facilitates the iNEMI PCB & Laminate Technology Implementation Group (TIG).\\\\nThe International Electronics Manufacturing Initiative (iNEMI) is a not-for-profit, R&D consortium of approximately 90 leading electronics manufacturers, suppliers, associations, government agencies and universities.\\\\n \\\\n\\\\n \\\\n \\\\n\\\\n \\\\n