Srinath y

Mechanical Component Design Engineer at Intel Corporation

Role
Senior Thermal Mechanical Engineer at Intel
Location
Hillsboro, OR, US
LinkedIn followers
500 followers

About Srinath y

I am a graduate student in Mechanical Engineering with ten years of professional experience and one year of research experience in FEA.Experience in data mining, post-processing, identifying improvements in the efficiency of equipment, and applying Geometric Dimensioning and Tolerances.Solid understanding of fundamentals of engineering coupled with a multi-disciplinary industrial experience attained through internships at reputed organizations.A dynamic and hardworking individual with a learning and mentoring attitude, good interpersonal skills, and ability to work in a team environment.I believe in constant learning and improving my skills, so currently working on Arduino. The future belongs to those who can merge the disciplines and create new things.Software/Hardware tools: Solid Works, Solid Works Simulator, Catia V5, Ansys Work Bench, ABAQUS, Excel Macro. Strong knowledge in Solid Modelling and Stress Analysis, Geometric Dimensioning, and Tolerances. Trigonometry, Coordinate geometry.

Experience

  1. Senior Thermal Mechanical Engineer

    Intel

    Aug 2016 — Present

    Engineered thermal management solutions for mm-Wave antenna systems and compact electronic enclosures, enhancing device reliability and user experience. Spearheaded thermal design initiatives, including liquid-cooled cold plates and manifolds, for hyperscale data center platforms, ensuring compliance with industry standards and deployment readiness. Designed cost-effective, high-performance heatsinks for memory modules used in client and server platforms, balancing thermal efficiency with manufacturability. Lead mechanical designer for flagship products showcased at Mobile World Congress (Barcelona), aligning with industrial design and user-centric aesthetics. Collaborated with electrical, RF, and manufacturing teams to deploy test modules to Intel factories, ensuring seamless integration and validation. Selected materials optimized for RF transparency, ingress protection (IP), and additive manufacturing, supporting rapid prototyping and mass production.

Education

  • Portland State University

    Master's Degree, Mechanical Engineering

  • Shanmugha Arts, Science, Technology and Research Academy

    Bachelor of Technology (BTech), Mechatronics, Robotics, and Automation Engineering

    2008 — 2012

  • SASTRA University

    Bachelor's Degree, Mechatronics, Robotics, and Automation Engineering

  • Portland State University

    Master's degree, Mechanical Engineering

    2014 — 2016

Skills

  • Microsoft Word
  • Abaqus
  • Powerpoint
  • Autocad
  • Microsoft Office
  • Catia
  • Engineering
  • C
  • Programming
  • Matlab
  • C++
  • Solidworks
  • Finite Element Analysis
  • Computer-Aided Design (Cad)
  • Nx Unigraphics
  • Cad
  • Ansys
  • Testing

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Srinath y — Senior Thermal Mechanical Engineer at Intel in Hillsboro, OR, US | Unifers