Srikanth Gunti
Advance Semiconductor Packaging 2.5D/3D | Product Packaging Engineering Manager
- Role
- Advance Semiconductor Packaging 2 5d 3d Product Packaging Engineering Manager at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
About Srikanth Gunti
8+ years of experience in Advanced Node development activities at intel. Responsible for Packaging development for first-of-its-kind Hybrid bond interface (HBI) product (Clearwater Forest) at intel. End to end ownership as a Platform Integrator from HBI to Rel.
Experience
Advance Semiconductor Packaging 2 5d 3d Product Packaging Engineering Manager
Jun 2025 — Present · Hillsboro, OR, US
Education
University of South Florida
Doctor of Philosophy (Ph.D.), Mechanical Engineering
2012 — 2017
Osmania University
Bachelor's degree, Mechanical Engineering
2006 — 2010
Skills
- Biw
- Finite Element Analysis
- Customer Value Proposition
- Vehicles
- Remediation
- Microsoft Office
- Lubrication Science
- Autocad
- Engineering
- Uv/Vis Spectroscopy
- Matlab
- Nanocomposites
- Solidworks
- Gas Chromatography
- Manufacturing
- Microsoft Excel
- Photocatalyst
- Ftir
- Lubricant Additive Chemistry
- Nx Unigraphics
- Automotive Engineering
- Mechanical Engineering
- Unigraphics
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