Sreeram Uday Kumar
Senior Hardware Design Engineer @Lantronix
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WORK HISTORY
Senior Hardware Design Engineer @Lantronix
Hyderabad, IN
Hardware architecture design for new products design based on Qualcomm chipsets, Prototype design and design feasibility analysis in terms of specifications and BOM for cost estimationSchematic Design, BOM and Gerber Design for Hardware Development Kits based on Qualcomm 865, 8550, 8150, 8295,IQ6 and IQ8 series chipsets.Power tree creation and analysis, product documentation (FRS, PRD, DFMEA, Design review checklist), test plan creation and execution.Components selections as per Automotive and Industrial grade, design, update library and database with new componentsHW design support (Design review and bring up support) based on Qualcomm chipsets for multiple client projects.Schematic Design and PCB Design reviews (internal review) as per PCB checklist and DFMEA.New design techniques by using Altium software features to improves efficiency and save time – Draftsman feature and preference update.Redmine tool management – with HW issues tickets and project development activities.Hardware lab setup at Hyderabad, India Office.Hardware board bring up, testing, debugging and root cause analysis.
EDUCATION
National Institute of Technology , Patna
Bachelor of Technology (B.Tech.), Electronics and Communications Engineering
V. R. High school
10th standard, S. S. C.
NARAYANA JUNIOR COLLEGE
Intermediate, M. P. C
SKILLS
ABOUT SREERAM UDAY KUMAR
Over 9 years’ experience as Hardware Architect, Product Designing and Development in IoT, Automotive and Consumer Electronics, currently working with Lantronix India Pvt Ltd as Senior Hardware Engineer.Schematic and PCB Design, Component’s selection, EBOM Generation, Gerber Generation, and release for PCB Manufacturer, Testing, Debugging, Board bring up.Worked on communication protocols like SPI, I2C, I2S, UART, MIPI, LPDDR2 & LPDDR3, USB, Wi-Fi, GPS, BT, PCIe, HDMI, DSI, CSI, M.2, Ethernet, LCD, Acoustics, PMIC, RF (2G, 3G & 4G).Designed multilayer mixed signal PCB – up to 14 Layers PCBs from schematic netlist.Efficient in using of lab equipment’s for testing and debugging purpose like Agilent 8960, Oscilloscope, DC Battery Analyser, Communication Tester CMW500 & CMU200, ESD & Surge Tester.Experienced in using ECAD designing tools Altium, OrCAD Cadence, System Capture and PADS Logic, PADS Layout and PADS Router, Gerber creation and editing using CAM350.Visited PCB Fabrication and SMT Plants during project development stages in Shenzhen, ChinaExperience in coordinating across different projects and taking completeownership for execution of the on-going projects in terms of project timelines,resources, internal team reviews of deliveries and co-ordination with cross functional teams – ID, Mechanical and Software teams.Experience as Team Lead of 8 HW Design Engineers for Baseband, RF andPCB layout.Skilled in using Redmine and Agile for project planning and data management.Preparing Product Requirement Documents (FRS, PRS), Prototype Designing (Pre-Design Analysis), Power Tree creation and analysis, Test Plan, Costing,Schematic Design and Development, Board-bring up, Testing and Debugging, Product Documentation and Sign-off for release.
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