Sree Harsha Maddineni
Advanced Silicon Packaging Technologist | TPM | CPO
- Role
- Packaging R & d Integration Engineer Tpm Co-packaged Optics at Intel
- Location
- Beaverton, OR, US
- LinkedIn followers
- 500 followers
About Sree Harsha Maddineni
Experienced Technologist and Technical Program Manager specializing in semiconductor…
Experience
Packaging R & d Integration Engineer Tpm Co-packaged Optics
Feb 2022 — Present · Hillsboro, OR, US
Education
Jawaharlal Nehru Technological University
Bachelor of Technology (B.Tech.), Mechanical Engineering
2009 — 2013
Arizona State University
Master's degree, Mechanical and Aerospace Engineering
2013 — 2015
Skills
- Numerical Analysis
- Heat Transfer
- Aerodynamics
- Design of Experiments
- Manufacturing
- Microsoft Excel
- Powerpoint
- Cad
- Management
- Leadership
- Project Management
- Solidworks
- Time Management
- Cfd
- Testing
- Teamwork
- Aerospace Engineering
- Autocad
- Social Media
- Public Speaking
- Abaqus
- Hemodynamics
- Product Development
- C
- Programming
- C++
- Mechanical Engineering
- Unigraphics
- Six Sigma
- Catia
- Customer Service
- Engineering
- Simulations
- Fluent 15
- Research
- Cfx
- Ansys
- Fortran
- Matlab
- Medical Devices
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