Suin Park
PTD Module Development Engineer (TSV Dry Etch) at Intel Corporation
- Role
- Process Engineer at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
About Suin Park
Intellectually curious and driven, aspiring to be an exceptional specialist in the field of nanotechnology; passionate entrepreneur and engineer seeking to impact and bring change to people around the world.
Experience
Process Engineer
May 2022 — Present · Hillsboro, OR, US
PTD Through-Silicon Via (TSV) Dry Etch Module Development Engineer
Education
University of California, Berkeley
Exchange Program, Materials Science Engineering
2018 — 2018
Yonsei University
Nanotechnology
2014 — 2020
Gyeonggi Suwon International School
IB Diploma
2010 — 2013
University of Illinois Urbana-Champaign
Master of Science - MS, Materials Science and Engineering
2020 — 2021
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