Gurpreet Singh

About Gurpreet Singh

As a Principal Engineer at Intel Corporation, I have over 9 years of experience in advanced patterning, a key enabler for aggressive device scaling. I lead a team of integrators and process experts, and work jointly with design teams, to deliver novel solutions for next-generation logic and memory devices. My core competencies include semiconductor process and integration, materials science, nanotechnology, surface chemistry, and block copolymer self-assembly. I have authored multiple patents and publications in these fields, and have received prestigious awards and honors for my academic and research achievements. I am passionate about innovating and collaborating to overcome the challenges and opportunities in the semiconductor industry.

Experience

1. Principal Engineer

   Intel

   Nov 2023 — Present

Education

• The University of Akron

  Ph.D., Polymer Engineering

  2009 — 2013

• Institute Of Chemical Technology

  B.Tech., Polymer Engineering and Technology

  2005 — 2009

Skills

• Photolithography
• Composites
• Optical Microscopy
• Materials Science
• Thin Films
• Matlab
• Image Analysis
• Electrochemistry
• Nanocomposites
• Nanotechnology
• Nanomaterials
• Ftir
• Process Engineering
• Tem
• Afm
• Materials
• Nmr
• Plastics
• Organic Chemistry
• R&D
• Tga
• Coatings
• Rheology
• Uv-Vis
• Differential Scanning Calorimetry
• Polymer Science
• Uv/Vis
• Polymer Nanocomposites
• Scanning Electron Microscopy
• Surface Chemistry
• Polymer Chemistry
• Polymer Physics
• Powder X-Ray Diffraction
• Electrospinning
• Nanoparticles
• Polymer Characterization
• Design of Experiments
• Polymers
• Characterization
• Spectroscopy