Siddarth Kumar

About Siddarth Kumar

Specialties: Advanced Packaging, Semiconductors, Reliability, Design, Micro fabrication (Soft lithography), Biomechanics, Development of rehabilitation tools for the disabled

Experience

1. Senior Technical Program Manager, Advanced 2 5d 3d Packaging Pathfinding

   Intel

   Nov 2022 — Present

   Pathfinding lead for industry first EMIB-T with pitch scaling (45um->40um->35um).*Key advanced packaging technologies added to Intel roadmap to enable future HPC & AI products.*Led DR definition, defined & executed phased TV strategy to demonstrate PF goals & DR validation.*Implemented novel co-design strategies for rapid scaling with multiple technical solutions to meet yield & reliability goals. Next generation advanced packaging building blocks @ Technology Research & APTM

Education

• Massachusetts Institute of Technology

  Doctor of Philosophy (Ph.D.), Mechanical Engineering

  2006 — 2011

• Massachusetts Institute of Technology

  Master of Science (M.S.), Mechanical Engineering

  2004 — 2006

• Indian Institute of Technology, Delhi

  BTech, Production and Industrial Engineering

  2000 — 2004

Skills

• Characterization
• R&D
• Finite Element Analysis
• Biomechanics
• Simulation
• Simulations
• Afm
• Research and Development (R&D)
• Reliability
• Scanning Electron Microscopy
• Latex
• Numerical Analysis
• Experimentation
• Design of Experiments
• Sensors
• Semiconductors
• Materials Science
• Mems
• Fluid Mechanics
• Thin Films
• Microfabrication
• Testing