Shripad Kulkarni

M.S. in Electrical Engineering | Electronics Engineer | Hardware Engineer | Power Electronics Engineer| Embedded Engineer | Component Engineer | Product Benchmarking

Role
Technology Analyst at Infosys
Location
Bengaluru, KA, IN
LinkedIn followers
500 followers
Information TechnologyView LinkedIn profile

About Shripad Kulkarni

Experienced Electrical Engineer committed resolve complex issues with excellent knowledge of Electrical technologies, looking for full time opportunities with commitment to keep up with fast paced environmentTechnical Skills. Programming skills: Python, C. Cloud Services: AWS Cloud Services. Power Converters: AC-DC, DC-AC, AC-AC, DC-DC, Battery Systems. Protocols: Modbus, SNMP, RS232, RS485, Ethernet, TCP/IP, Battery Management Systems, Electric Vehicles. Electronics: Signal generators, Schematics, Solder, Oscilloscope, Harmonic Analyzer, Component selection. IOT: AWS IOT core with Raspberry Pi and TI sensor boards, IoT sensors. Tools/Software: Altium, Electrical CAD, Cadence Virtuoso, MATLAB, VLSI, PSpice, LTSpice, MS VISIO etc. Chargers: High Power Chargers (130V, 200 Amps), High Frequency Chargers, Marine Chargers, Rail-Road. Protocols: Modbus, SNMP, Serial Communication. Wireless Technologies: Reed Solomon Code, Galois Field GF(q), BCH codes, Linear block codes.

Experience

  1. Technology Analyst

    Infosys

    Oct 2021 — Present · Bengaluru, IN

    Toyota RRLP – Electronics | Value Engineering :PCB-Board level product tear down and hardware support activities.(2022 Tundra, 2021 Audi Q8, 2021 Ford Escape)Component Engineering – Parts identification, part EOL cycle status management, Alternate Part suggestion, Obsolescence management, cost optimization with alternate parts, design optimization with alternate parts. Evaluation of PCB design, BOM creation, BOM analysis.Should costing analysis, Bench marking of Electronic components against competitors products. Circuit Extraction and circuit analysis, Schematic Design, Cost optimization and debug. Manufacture Part number validation, Life cycle management of components and Alternate Part suggestion according to the automotive industry standard requirements.PCB Material and component Assembly cost optimization, component regulatory and compliance management evaluation.Design comparison and Design benchmarking against competitor\'s products, suggestion for the design modification for the cost optimization. CAE Component Engineering :EOL Management – Alternate part suggestions for the components on End-of-life cycle and Design change recommendations according to the suggested alternate parts.Obsolescence Management - Alternate part suggestion for the obsolete components and design change recommendations according to the suggested alternate parts.Cost optimization through alternate part suggestion, Identify (Form – Fit – Function), alternate parts for the cost and design optimization. Component Evaluation for RoHS, REACH, standards and suggest alternate for the existing components to meet these standards.Supply chain management – shortlisting additional vendors for component supply.EMC testing

Education

  • BLDEAs College of Engg. & Technology, BIJAPUR

    Bachelor’s Degree, ELECTRONICS AND COMMUNICATION

    2010 — 2014

  • Sainik School, Bijapur

    High School Diploma, Science

    2003 — 2010

  • Illinois Institute of Technology

    Master of Science - MS, Electrical, Electronics and Communications Engineering

    2016 — 2017

  • Visvesvaraya Technological University

    Bachelor of Engineering - BE, Electrical, Electronics and Communications Engineering

    2010 — 2014

  • Illinois Institute of Technology

    Master of Science - MS, Electrical, Electronics and Communications Engineering

Skills

  • Packet Tracer
  • Unix
  • Windows Server
  • Ccna
  • Routing Protocols Like Rip
  • Ripv1
  • Pap
  • Dynamic Host Configuration Protocol (Dhcp)
  • Vmware
  • Dns
  • Eigrp
  • Secure Shell (Ssh)
  • Prtg
  • Office 365
  • Linux
  • Ppp
  • Microsoft Word
  • C
  • Pppoe
  • Cadence
  • Wireless Sensor Networks
  • Cisco Vpn
  • Cisco Ios
  • Cpri
  • Transmission Control Protocol (Tcp)
  • Open Shortest Path First (Ospf)
  • User Datagram Protocol (Udp)
  • Powerpoint
  • Ripv2
  • Internet Protocol Suite (Tcp/Ip)
  • Iot
  • Wireshark
  • Hdlc
  • Wide Area Network (Wan)
  • Ipsec
  • C++
  • Contiki
  • Microsoft Office
  • Matlab
  • Virtual Private Network (Vpn)

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Shripad Kulkarni — Technology Analyst at Infosys in Bengaluru, KA, IN | Unifers