Shrinivas Gopalan Uppili
Engineering Lead @ Qualcomm | AR & 5G Baseband | Silicon to Systems | Project Management
- Role
- Sr Staff Engineer - Hardware Systems Xr & 5g Modem Chipsets at 高通
- Location
- San Diego, CA, US
- LinkedIn followers
- 500 followers
About Shrinivas Gopalan Uppili
Result-oriented hardware engineering lead with 15 years of experience in system…
Experience
Sr Staff Engineer - Hardware Systems Xr & 5g Modem Chipsets
Nov 2018 — Present · San Diego, CA, US
Lead, AR Chipset HW systems – QCOM’s 1st chipset family optimized ground up for the glasses form factor-Work closely with product managers on definition, requirement analysis, and presentations to lead customers-Develop AR glass proof of concept to ideate, identify metrics, trade-offs, and validate product requirements-Designed a multi-chip system and PCB architecture with 45% lesser wire counts, 40% smaller PCB area -Collaborate with global multi-disciplinary teams (ME, Thermal, UX) for reference designs and HW platforms-Manage customer surveys for PCB system design and 3rd party component selection/customization optionsLead, Modem Chipset (SDX) HW systems – Multiple High tier 5G & QCOM’s 1st 5G-NR low-cost modem-Reference PCB design and optimized baseband solution area for multiple generations of Apple products-5G M2 card proof of concept- Feature-rich 3052 high tier & cost/area optimized 3042 low tier variants-Streamline chipset product SKUs based on memory variant (dual memory types), PCB cost & area Lead a global team of HW system engineers and manage deliverables across cross-functional teams Lead PCB guidelines library development & Tools/ Automation initiatives – Setup OKR, JIRA & Confluence
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