Shashikant Prabhakar
Senior Vice President - Hitech & ISV, and Center Head - Bengaluru at Persistent Systems | Ex - Harman | Ex - HCL
- Role
- Senior Vice President and Center Head at Persistent Systems
- Location
- Bengaluru, KA, IN
- LinkedIn followers
- 500 followers
About Shashikant Prabhakar
Shashikant Renake is a seasoned business leader with 29 years of extensive experience in Sales and Product Engineering. Throughout his career, he has held various roles, including Software Engineer, Solution Architect, Delivery and Sales Head, serving Hitech, ISV, and Semiconductor clients globally. He has a strong track record in managing large programs and strategic accounts, consistently executing aggressive growth strategies and exceeding targets. At Persistent Systems, currently leading India Sales for the Hitech BU. Earlier as a part of CEO office lead a Strategic Account Management Initiative covering the top 50 accounts focusing on 360-degree account Growth- At Harman (from July2012 to July2021) as a Director of Sales, was managing a Global Strategic Accounts portfolio with revenue size of $22 Million, sponsoring and Nurturing Executive Customer Relationships, Business Development, Account Management. • Achieved 70% of the $21.6 Million target in 6 months for 2021 • Won Sales Rainmaker, Hunter, and Strategic Partnership Award for 2020. • Won CEO club and Salesperson of the year award in 2018 for achieving a sales target by 200% • Won Achievers club award in 2017 for achieving a sales target by 190%- At HCL Japan (Jan2003 to July2012), played a key role in expanding the Telecom business in Japan. HIGHLIGHTS:Business Development: • Established and Nurtured Executive Customer Relationships for some of the top Fortune 500 companies and won over $150Mn+ business. • Helped clients co-create innovative products and solutions for the connected world focusing on Silicon Engineering, SaaS, Cloud, AI/ML, Mobile, and IoT. Product Engineering: • 20 years of end-to-end delivery Management experience covering complete software and Hardware development cycle • Handled multiple projects for Intel, NEC, NTT Docomo, SanDisk, Samsung, Lucent, and Lantiq communication as a Senior Solution Architect and Program Manager with a team size of 500+ engineers. Excellent knowledge of Intel platforms, tools, and processes. • Instrumental in setting up VLSI practice in Harman. • As a Solution Architect for 9 years in Tokyo, played a key role in expanding HCL business in Japan Strategy Office and Management: • Leading globally distributed teams & cross-functional projects • Project and people management, Team Size handled:500+ • Collaborative development across various engineering functions • Customer Relation Management
Experience
Senior Vice President and Center Head
Apr 2025 — Present
Education
Cusrow Wadia Institute Of Technology
Electronics and Telecom engineering
The University of Texas at Austin
Post Graduate Program in Data Science, and Business Analytics
Purdue University
Post Graduate Program in Digital Transformation
Find verified contacts for anyone on LinkedIn
Unifers gives sales teams verified emails and direct dials, enriched profiles, and outreach that lands in the inbox.
Free plan included · No credit card required
This profile is compiled from publicly available professional sources. Unifers is not affiliated with or endorsed by LinkedIn. Request removal of this profile.