Shamiparna Das

Metrology Module Engineer at Intel - New Mexico. Held Defect Reduction Engineer and Process Engineer @ Intel Corporation in the past | Have a Ph.D. in Materials Science and Engineering

Role
Metrology Module Engineer Packaging (Nm Dmo) Rio Rancho, Nm at Intel
Location
Hillsboro, OR, US
LinkedIn followers
500 followers

About Shamiparna Das

At Intel Corporation, my pursuit of process excellence is relentless, with a focus on…

Experience

  1. Metrology Module Engineer Packaging (Nm Dmo) Rio Rancho, Nm

    Intel

    Jan 2025 — Present · NM, US

Education

  • Indian Institute of Science (IISc)

    Master’s Degree, Materials Engineering

    2009 — 2011

  • University of North Texas

    Doctor of Philosophy (Ph.D.), Materials science and Engineering

    2012 — 2016

  • National Institute of Technology Rourkela

    Bachelor’s Degree, Ceramic Engineering

    2005 — 2009

Skills

  • Scanning Electron Microscopy
  • Magnesium (Light Alloys)
  • Materials
  • Metallographic Sample Preparation
  • Tem
  • Composites
  • Toughness Testing
  • Powder X-Ray Diffraction
  • Friction Stir Welding
  • Finite Element Analysis
  • Characterization
  • Rietveld
  • Engineering
  • Heat Treatment
  • Mechanical Testing
  • Ultrasonic Welding
  • Laser-Friction Hybrid Welding
  • Astm Standards
  • Microsoft Word
  • Dta
  • Metallurgy
  • Steels (Ferrous Alloys)
  • Optical Microscopy
  • Dielectric Characterization
  • Microsoft Office
  • Manufacturing
  • Powerpoint
  • Microsoft Excel
  • Digital Image Correlation
  • Research
  • Materials Science
  • Tensile Testing
  • Failure Analysis

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Shamiparna Das — Metrology Module Engineer Packaging (Nm Dmo) Rio Rancho, Nm at Intel in Hillsboro, OR, US | Unifers