Senthil Erulappan

Head of Engineering - Global CDD, Risk & Compliance at Worldpay | Payments | Fintech | Regtech |Digital/Cloud transformation

Role
Senior Director, Development Head of Engineering - Global Cdd, Risk & Compliance at Worldpay
Location
Cincinnati, OH, US
LinkedIn followers
500 followers

About Senthil Erulappan

Results driven and customer focused Technology Leader with over 25 years of diverse IT experience, excelling in building, scaling and maintaining enterprise scale products and platforms. Proven track record of leading & delivering, large-scale technology initiatives aligning business goals with technology solutions to drive process improvements, competitive advantage and bottom-line gains.Excellent communication, facilitation, and influencing skills with all levels of management, customers and Vendor partnersSpecialties: Digital/Cloud transformation, Strategic Planning,Project/Program Management,Solution Architecture, AML/Risk & compliance, Product Engineering, Product/Vendor evaluation, Vendor Management, Scaled Agile Framework, Mergers & Acquisition, Devops

Experience

  1. Senior Director, Development Head of Engineering - Global Cdd, Risk & Compliance

    Worldpay

    Jun 2025 — Present · Cincinnati, OH, US

Education

  • University of Cincinnati Carl H. Lindner College of Business

    Leadership Academy - Technology Leadership

    2017 — 2017

  • Vellore Institute of Technology

    B.S, Mechanical Engineering

    1991 — 1995

  • The Wharton School

    Entrepreneurship Acceleration Program

    2022 — 2022

Skills

  • Consulting
  • Project Management Office (Pmo)
  • Business Process
  • Project Management
  • Visio
  • Management
  • Process Improvement
  • Data Warehousing
  • Enterprise Software
  • Software Development
  • Bank Mergers
  • Requirements Gathering
  • Sdlc
  • Solution Architecture
  • Business Process Improvement
  • Pmp
  • Business Analysis
  • Leadership
  • Program Management
  • Software Project Management
  • Integration
  • Requirements Analysis
  • Db2
  • Vendor Management

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Senthil Erulappan — Senior Director, Development Head of Engineering - Global Cdd, Risk & Compliance at Worldpay in Cincinnati, OH, US | Unifers