Sean Sousa

Product Engineer @Nitto Americas

Fremont, CA, US

Designed Flexible Printed Circuits used in world’s most popular camera and in Hard Disk Drives•Optimized mechanical components using FEA, achieving a 30% stress reduction and eliminating Random Vibration test failures (reducing failure rate from 20% to 0%)•Developed a DFM workflow for injection molding jigs and fixtures, reducing tooling time by 1 week by pre-checking common DFM issues in-house, minimizing design iterations and reducing dependency on supplier feedback cycles•Reduced simulation-to-test deviation from 30% to 5% by refining FEA material properties through targeted failure analysis, enabling significantly faster design iterations.•Optimized Components around Stiffness, Random Vibration, Drop/Shock, Thermal and DCR.•Applied Tolerance Analysis with Worst case, RSS, and Monte Carlo to jigs used in mass production to ensure fit.•Worked cross-functionally with overseas teams and suppliers to ensure DFM alignment, enhance product yield and reduced manufacturing defects.

San Francisco State University

Bachelor of Science (B.S.), Mechanical Engineering

Santa Clara University

Master's degree, Mechanical Engineering