Scott J. J.
Extensive background in semiconductor packaging, including quality and reliability, manufacturing, and simulation.
- Role
- Principal Hardware Engineer, Ssd Architecture at Micron Technology
- Location
- Spokane, WA, US
- LinkedIn followers
- 500 followers
About Scott J. J.
Experienced Senior Manager with a demonstrated history of working in the semiconductor industry. Skilled in packaging design, FMEA, failure analysis, package simulation, packaging quality/reliability, SMT, and manufacturing. Extensive management experience, building and developing junior and senior engineering teams. MSME and PE license in Idaho. Interested in challenging opportunities and living and working abroad.
Experience
Principal Hardware Engineer, Ssd Architecture
May 2022 — Present · Spokane, WA, US
Education
Spokane Falls Community College
Associate Arts
1992 — 1994
Walden University
MSME, Mechanical Engineering
1998 — 2005
Washington State University
BSME, Mechanical Engineering
1994 — 1998
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