Sunayna Bashar

About Sunayna Bashar

With over 7 years of experience at Intel Corporation and specializing in advanced packaging technology, I\'ve played an integral role in developing next-gen Co-Packaged optics products and refining semiconductor processes. My technical expertise is matched by strong project management and leadership skills, enabling effective cross-functional collaboration and innovation.

Experience

1. Process Integration Development Engineer Technical Program Manager

   Intel

   Jul 2022 — Present · Hillsboro, OR, US

   Managed wafer-level and package assembly processes, for Intel\'s next-generation Co-Packaged Optics (CPO) projects, while gaining extensive knowledge of semiconductor backend processes. Through this exposure, developed a deep understanding of advanced packaging technologies, including both single photonic die and integration with Intel\'s EMIB and Foveros technologies.• Partnered with cross-functional engineering teams to improve product\'s launch readiness, defining clear milestones, ensuring timely progress and promptly escalating significant obstacles to upper management for effective resolution. Also provided regular, executive-style updates on the program, to a wide-ranging audience including senior management, addressing technical, scheduling, and logistical aspects of my focus area.• Completed NPI documentation and managed NPI and baseline lot assemblies, ensuring quality and efficiency across both online and offline platforms.• Streamlined assembly workflows, resolving issues through root cause analysis, problem-solving models, DOEs, and failure analysis, significantly boosting yield for OFC 2024 proof of concept showcase. Additionally, maintained comprehensive inventory tracking and control for numerous items consistently.• Led a mechanical working group utilizing FMEA for a robust optical package design, with a focus on engineering a sophisticated pluggable optical connector for efficient coupling and low insertion loss.• Facilitated the progression of CPO projects from initial exploration to development stage, surpassing key metrics and securing multiple customer engagements.

Education

• University of Dhaka

  Bachelor of Science (B.S.), Applied Physics & Electronics

  2007 — 2012

• University of California, Riverside

  Doctor of Philosophy (PhD), Electrical Engineering

  2013 — 2016

Skills

• Wet Chemical Etching
• Semiconductor Lasers
• Chemical Vapor Deposition (Cvd)
• Device Characterization
• Afm
• Microsoft Office
• Photolithography
• Scanning Electron Microscopy
• Edx
• Nanotechnology
• Semiconductor Fabrication
• Reactive Ion Etching
• Nanowires
• Sputtering