Sarang Bhaway
Advanced Packaging Integration Engineer at Intel Corporation
- Role
- Wafer Level Integration Engineer at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
About Sarang Bhaway
Dedicated team player involved in high performing cross-functional teams Project…
Experience
Wafer Level Integration Engineer
May 2023 — Present
Education
The University of Akron
Doctor of Philosophy (Ph.D.), Polymer Engineering
2011
Institute of Chemical Technology (formerly known as U.D.C.T.) Mumbai
Bachelor of Technology (B.Tech.), Polymer Engineering Technology
2007 — 2011
Skills
- Tem
- Afm
- Research and Development (R&D)
- Polymer Nanocomposites
- Materials
- Materials Science
- Ftir
- Dry Etch
- Thin Films
- Composites
- Characterization
- Structure-Property Relationships
- Spectroscopy
- Plasma Etch
- Chemistry
- Chemical Engineering
- Coatings
- Surface Chemistry
- Polymers
- Nanocomposites
- Electrochemistry
- Research
- Nanotechnology
- Polymer Engineering
- Nanoparticles
- Polymer Characterization
- Polymer Physics
- Powder X-Ray Diffraction
- Ms Office
- Tga
- R&D
- Block Copolymers
- Polymer Science
- Uv/Vis
- Microsoft Office
- Porous Materials
- Sem
- Polymer Chemistry
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