Sanket Desai
Senior Product Development Engineer @American Packaging Corporation
Columbus, WI, US
EMAILS
s•••••@americanpackaging.com
MOBILE NUMBERS
+13•••••••90
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WORK HISTORY
Jan 2025 — Present
Senior Product Development Engineer @American Packaging Corporation
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Columbus, WI, US
EDUCATION
2018 — 2020
Rochester Institute of Technology
Master's degree, Packaging Science
2014 — 2018
SIES Graduate School Of Technology
Bachelor of Engineering, Printing and Packaging Technology
ABOUT SANKET DESAI
Senior Product Development Engineer @ American Packaging Corporation | Leadership, Production Process Development
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