Sandeep Bansal
Package and Board Design
- Role
- Principal Engineer- Package Board Design at Renesas Electronics
- Location
- Delhi, DL, IN
- LinkedIn followers
- 500 followers
About Sandeep Bansal
Leading team of 20+ engineer team of board design, Package Design & PCB + Package…
Experience
Principal Engineer- Package Board Design
Jan 2025 — Present · Noida, IN
Education
IET Alwar
Bachelor's Degree
2000 — 2004
Birla Institute of Technology and Science, Pilani
Master of Business Administration - MBA
2016 — 2018
Happy senior Higher secondary School
12th
1997 — 1998
Happy senior Higher secondary School
10th
1995 — 1996
Shanmugha Arts, Science, Technology and Research Academy
Master's Degree
2004 — 2006
Skills
- Ethernet Interface
- Debugging
- Altium Designer
- Gsm
- Allegro
- Spi, Compact Flash, Ide, Fpga, Cpld Based Design, Pci, Pci Express, I2c
- Hardware Architecture
- Arm
- Linux
- Testing
- Schematic Capture
- Spi
- Video Interface: Duallink Dvi, Hdmi, Display Port
- Digital Signal Processors
- Embedded Software
- Embedded C
- Usb
- Microcontrollers
- I2c
- Electronics
- Embedded Linux
- Orcad
- Schematic & Pcb Tools: Orcad15.7, Allegro 15.2, Altium, Mentor Graphics
- Peripheral Interfaces: 10/100 Mbps Ethernet, Rs-232 Interface, Usb Interface
- Microprocessors
- Memory Interfaces: Sdram, Ddr3/Ddr Sdram, Nand Flash and Nor Flash
- Pcb Design
- Product Development
- Perl
- Embedded Systems
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