Salam Aburwein

About Salam Aburwein

I am highly motivated and award-winning, MBA Engineering Management Professional with…

Experience

1. Pmts Packaging Engineer, Rtg Packaging

   AMD

   Jul 2018 — Present

   A Principal Member of Technical Staff and a lead engineer in the RTG Packaging team I work with different groups to define the scope, feasibility, and planning for new programs Front End). o Work with team members to find the right package architecture (tech, size, stack up BOM, etc.) considering cost, reliability, performance and PCB considerations. o Prepared GANTT schedules for programs to outline the different timelines from NPI to production. o Interface with the BU to ensure package alignment with business goals/schedule. o Interface with the OSATs to prepare FMEAs and define risk and prepare for device bring up. o Interface with the different engineering teams within AMD such as SI/PI, Package Design, Thermal, QA, cost, etc. to coordinate the completion of packaging activities according to schedule. I work with outside vendors to manage and see through the delivery of initial packaged parts to HVM ramp up (Backend) o Ensure the availability of materials at different vendors such as OSATs, Substrate Vendors and foundries. o Prepare and execute plans for package prequalification and qualification testing such as HTS, TC, Hast and BLRT based on customers’ requirements and complete FA as needed. o Execute all package related bring up activities from tooling to second sourcing to meet mass production requirements and schedule. o Work with product engineering and vendor management to provide initial packaged samples and define and meet yield needs.

Skills

• Leadership
• Eda
• Fpga
• Program Management
• Business Strategy / Consulting
• Management
• Quality Management
• Thermal Engineering
• Microelectronics
• Thermal
• Asic
• Ansys
• Engineering
• Cross-Functional Team Leadership
• Soc
• Flip Chip
• Sales / Marketing
• Ic
• System on a Chip (Soc)
• Semiconductors
• Circuit Design
• Product / Project Management
• Simulations
• Assembly / Test Engineering
• Cmos
• Operations / R&D
• Analog
• Computer Engineering
• Mixed Signal
• Reliability
• Ic Packaging Engineering
• High-End Retail
• Integrated Circuits (Ic)
• Debugging
• Application-Specific Integrated Circuits (Asic)
• Verilog