Sai Kumar Voriganti

Ic Package Layout Engineer @Micron Technology

Hyderabad, IN

I’m well-rounded in IC packaging design & development from NPI project management, package feasibility, substrate design, SI/PI engineering teams, OSAT/Vendor & customer engagement• I have good experience in package layout Wire Bonding (COB, BOC), FCIP technologies.• And sound knowledge of Design Rules Check and Familiar with Design for Manufacturing & Assembly process.• I have good experience in Co-development between silico-package as well as Package-PCB.• Work with IC design team to define IC package requirements.• Work with software vendor to improve the Tool capabilities.• Proficiency with industry-standard EDA tools for IC design with a strong understanding of their underlying operation.• Strong communication skill and good teamwork skills in working together to achieve goals.