Ryan Parrott
Pathfinding Lead at Intel Corporation
- Role
- Manager at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
About Ryan Parrott
Innovative and results-driven Senior Packaging Engineer with nearly two decades of experience in packaging design, logistics optimization, and supply chain innovation at Intel Corporation. Proven track record of delivering cost-saving initiatives, leading cross-functional teams, and managing complex packaging and material handling projects from concept to implementation. Recognized speaker and award finalist in industry forums, with a passion for cutting-edge solutions and continuous improvement.Specialties: Package Engineering - Electronics Product Packaging, Fragility. Supply Chain Modeling. Environmental Responsibility.
Experience
Manager
Sep 2024 — Present · Portland, OR, US
Collaterals and Media Development Group Leader - managing a team to engineers supporting factory modules with collateral design and media to support Intel’s wafer level assembly division. Driving safety, factory output, cost savings, and pathfinding development for new technologies.
Education
California Polytechnic State University-San Luis Obispo
Industrial Technology, Packaging
2000 — 2004
Skills
- Electronics Packaging
- Supply Chain
- Artioscad
- Solidworks
- Project Management
- Continuous Improvement
- Cross-Functional Team Leadership
- Packaging
- Materials
- Product Development
- Packaging Engineering
- Testing
- Packaging Design
- Tops Engineering
- Lean Manufacturing
- Manufacturing
- Program Management
- Supply Chain Management
- Engineering
- Artios Cad
- Process Improvement
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