Ryan MacKiewicz
Senior Technology Development Area Manager, Advocate, Mentor, Semiconductor Enthusiast and Advanced Packaging Champion
- Role
- Global Sourcing Equipment and Materials Individual Contributor at Intel
- Location
- Beaverton, OR, US
- LinkedIn followers
- 500 followers
About Ryan MacKiewicz
With almost two decades of experience in the semiconductor industry, culminating in my current role as Advanced Packaging Area Manager, I have honed my expertise in transitioning equipment and processes from early development through high volume manufacturing. I have successfully guided multiple equipment sets from concept through all development phases and into full-scale production. I possess in-depth knowledge of factory systems, including facilitation, automation, and process control systems. As a strategic thinker, I have crafted both long- and short-term strategies to keep my teams at the cutting edge of technology. My greatest passion lies in developing and nurturing relationships, having built large teams from scratch and fostering strong collaborations with customers, suppliers, and internal teams.
Experience
Global Sourcing Equipment and Materials Individual Contributor
Nov 2024 — Present · Hillsboro, OR, US
Education
Oregon State University College of Business
Master of Business Administration - MBA, Organizational Leadership
Texas A&M University
PhD, Chemistry
2001 — 2005
State University of New York at Fredonia
Bachelor of Science (B.S.), Chemistry
1996 — 2000
Skills
- Design of Experiments
- Manufacturing
- Ic
- Metrology
- Semiconductor Manufacturing
- Semiconductors
- Spc
- Pvd
- Process Integration
- Process Simulation
- Automation
- Characterization
- Test Equipment
- Materials Science
- Failure Analysis
- Wet Etching
- Semiconductor Industry
- Engineering Management
- Etching
- Process Development
- Jmp
- Cvd
- Electronics
- Silicon
- Statistics
- Thin Films
- Lithography
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