Ryan Lavallee
Semiconductor Professional
- Role
- Advanced Packaging Lead at Marvell Technology
- Location
- Burlington, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
About Ryan Lavallee
Analog Layout Expert with a demonstrated history of producing results in the…
Experience
Advanced Packaging Lead
Nov 2024 — Present · US
Education
Penn State University
Master of Engineering Management, Systems Engineering
2013 — 2014
University of Vermont
Community Development and Applied Economics
2003 — 2004
Vermont Technical College
Bachelor of Applied Science (B.A.Sc.), Electromechanical Engineering
2005 — 2008
Skills
- Microsoft Office
- Vlsi
- Cadence
- Ic
- Technical Project Leadership
- Digital Electronics
- Innovus
- Project Management
- Vhdl
- Simulations
- Clock Tree Synthesis
- Mixed Signal
- Integrated Circuit Design
- Verilog
- Logic Design
- Cmos
- Linux
- Unix
- Problem Solving
- Xilinx
- Electrical Engineering
- Timing Closure
- Very-Large-Scale Integration (Vlsi)
- Physical Design
- Analog Circuit Design
- Cadence Virtuoso
- Excel
- Semiconductors
- Eda
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