Rose Mulligan
Silicon Photonics Packaging TD Engineer
- Role
- Silicon Photonics Packaging Td Engineer at Intel
- Location
- Chandler, AZ, US
- LinkedIn followers
- 500 followers
Experience
Silicon Photonics Packaging Td Engineer
Apr 2022 — Present · AZ, US
Education
University of Michigan
Chemical Engineering
1991 — 1995
Skills
- Cross-Team Collaboration
- Failure Analysis
- Flexible Approach
- Embedded Systems
- Lean Manufacturing
- Problem Solving
- Engineering Management
- Process Engineering
- Statistical Process Control (Spc)
- Project Planning
- Jmp
- Design of Experiments
- Characterization
- Semiconductors
- System Architecture
- Spc
- Ic Packaging
- Cross-Functional Team Leadership
- Manufacturing
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