Rohin Agny
Manufacturing Engineer at Amazon
- Role
- Manufacturing Engineer at Amazon Leo
- Location
- Seattle, WA, US
- LinkedIn followers
- 500 followers
About Rohin Agny
As an experienced semiconductor package failure analysis engineer, I have had the opportunity to work on some of the most critical aspects of package design and failure investigation. With a background that spans roles at NXP and Intel, I’ve built a strong foundation in failure analysis, tool and technique development, and root cause analysis, helping to drive quality and reliability improvements in advanced semiconductor packaging.In my role as an Engineering Manager at NXP, I led a team focused on identifying and solving complex package failure issues, ensuring that our products met the highest standards of reliability and performance. My experience as a Senior Package Failure Analysis Engineer allowed me to refine my skills in analytical problem-solving, utilizing various techniques to assess failures and recommend solutions to optimize product designs.At Intel, I had the privilege of working on the most advanced semiconductor packages, including 2.5D and 3D packaging technologies. I provided failure analysis support for these cutting-edge packages, driving continuous improvement and helping to solve some of the most complex packaging challenges in the industry.I am passionate about collaborating with cross-functional teams, leveraging my technical expertise to help deliver high-quality products and drive innovation. I thrive in environments where I can apply my analytical skills, leadership experience, and deep technical knowledge to address complex challenges and contribute to the success of the team.
Experience
Manufacturing Engineer
Aug 2025 — Present · Redmond, WA, US
Education
University of Washington
Bachelor of Science (B.S.), Materials Science and Engineering
2011 — 2015
Skills
- Pro Engineer
- Optical Microscopy
- Materials Science
- Failure Analysis
- Solidworks
- Microsoft Word
- Imagej
- Labview
- Expedition Pcb
- Sample Preparation
- Microsoft Excel
- Scanning Electron Microscopy
- Image Processing
- Matlab
- Fault Isolation
- Teamwork
- Java
- Soldering
- Hardware
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