Rob Munoz

Principal Engineer and Product/Solution Architect at Intel Corporation

Role
Principal Engineer at Intel
Location
Georgetown, TX, US
LinkedIn followers
500 followers

Experience

  1. Principal Engineer

    Intel

    Nov 2014 — Present · Austin, TX, US

    Create and maintain a fit between Intel technologies and customer needs. Co-led efforts to architect Intel® x86 Snow Ridge (with Grand Ridge as a follow-on) to gracefully transition Axxia® traditional RAN customers to Intel® x86 architecture, contributing to Intel\'s subsequent design wins and dominant market share in Radio Access Network infrastructure. Contributed to Snow Ridge and led Grand Ridge customer errata communication. Co-led the 2017 internal Intel \"Developing a Chiplet Ecosystem\" Technology Strategic Long-Range Plan (TSLRP) presented to executive leadership team and co-led the follow-on internal cross-Intel Chiplet working group. These efforts helped lead to Intel and industry collaborators driving UCIe to become the most widely adopted standard chiplet interconnect. Led white papers and contributed to several other Intel TSLRPs and other executive leadership team technology strategy presentations. Co-led highly successful efforts to expand technology leadership development program to Intel\'s Latinx technologists and other underrepresented groups. Since 2021, a third of Intel Latinx technologists and almost half of Intel black technologists who were promoted to Principal Engineer participated in this program. Contributor to and active participant in internal Intel Insights Discussion Forum meeting series. Patent grants include:US-10••••02-B2 Shaping of post-scheduling network pipeline jitterUS-10••••57-B2 Techniques for packet transmit schedulingUS-11••••71-B2 Removable interposerUS-11••••68-B2 Methods and apparatus to execute a workload in an edge environment Published patent applications include:US-20•••••••77-A1 PACKAGING ARCHITECTURE FOR MODULAR DIE INTEROPERABILITYUS-20•••••••07-A1 FINE-GRAINED DISAGGREGATED SERVER ARCHITECTUREUS-20•••••••62-A1 PACKAGING ARCHITECTURE WITH PATTERNED THROUGH-DIELECTRIC VIAS AND REDISTRIBUTION LAYERSUS-20•••••••27-A1 INTEGRATED PACKAGING ARCHITECTURE WITH SOLDER AND NON-SOLDER INTERCONNECTS

Education

  • Virginia Tech

    Bachelor of Science (BS) Summa Cum Laude, Computer Science

    1984 — 1988

  • The University of Texas at Austin

    Master of Science (MS), Computer Science

    1988 — 1989

Skills

  • Linux
  • Business Strategy
  • System Architecture
  • Wireless Technologies
  • Network Processors
  • C++
  • Systems Engineering
  • Product Management
  • Customer Support
  • Unix
  • Tcp/Ip
  • Marketing
  • Customer Satisfaction
  • Object Oriented Design
  • Software Development
  • Software Engineering
  • Solution Architecture
  • System on a Chip (Soc)
  • Technical Training
  • Soc
  • Product Marketing
  • Wireless
  • Ethernet
  • Requirements Analysis
  • Internet Protocol Suite (Tcp/Ip)
  • Pre-Sales Technical Consulting
  • Java

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Rob Munoz — Principal Engineer at Intel in Georgetown, TX, US | Unifers