Rishikesh Nikam
Packaging Engineer at Allegro MicroSystems, LLC
- Role
- Microelectronics Packaging Engineer at Allegro MicroSystems
- Location
- Manchester, NH, US
- LinkedIn followers
- 500 followers
About Rishikesh Nikam
Master of Science graduate with concentration in Mechanics and Design from Northeastern…
Experience
Microelectronics Packaging Engineer
Sep 2017 — Present · Boston, MA, US
Interacted with cross functional teams to understand, and translate business cases to packaging challenges• Assisted in design & development of new packages, process flows to support various business units within company• Interfaced with vendors, and suppliers to ensure high quality BOM selection for particular target qualification grade• Created AutoCAD drawings, 3D models, DFMEA & other documents for new packages to fulfill APQP requirements• Supported qualification and transition of new package to mass production• Attended a factory production line in Asia to help troubleshoot a problem regarding an ongoing package qualification• Strengthened the company\'s intellectual property by co-authoring, and reviewing patent applications with attorneys
Education
Northeastern University
Master's Degree, Mechanical Engineering
2014 — 2016
University of Mumbai
Bachelor’s Degree, Mechanical Engineering
2010 — 2014
Skills
- Rapid Prototyping
- Mechanical Engineering
- Cad
- 3d Modeling
- Finite Element Analysis
- Simulink
- Microsoft Office
- Matlab
- Plastic Part Design
- Manufacturing
- Powerpoint
- Microsoft Excel
- Sheet Metal Components
- Microfluidics
- Ansys
- Computer-Aided Design (Cad)
- Management
- Clean Rooms
- Mems
- Microsoft Word
- Solidworks
- Leadership
- Autocad
- Injection Molding
- Engineering
- Strategic Planning
- Microfabrication
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