Riley Erickson
Oatd Packaging R & d Engineer @Intel
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WORK HISTORY
Oatd Packaging R & d Engineer @Intel
Hillsboro, OR, US
EDUCATION
Weber State University
Bachelor's degree, Design Engineering Technology
University of Nevada-Las Vegas
Bachelor's degree, Mechanical Engineering
ABOUT RILEY ERICKSON
Mechanical Design Engineer offering a wealth of expertise in SolidWorks, Design for Manufacturing (DFM), prototyping, and 3D Printing. With a background spanning the aerospace and semiconductor industries, I have demonstrated a skill for translating intricate technical requirements into tangible mechanical drawings implementing GD & T standards. Proven ability to work in detail-oriented and fast-paced environments. Seeking to leverage my skills and expertise to contribute to a dynamic team and drive the development of cutting-edge products.
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