Richard Haberkern

About Richard Haberkern

Principal Artificial Intelligence & Mechatronics Systems Engineer designing edge-to-cloud products for aerospace, medical, industrial, and media. I bridge hardware, firmware, and software to help companies ship reliable, scalable systems—partnering directly with STMicroelectronics, NXP, Infineon, Onsemi, and Microchip to drive design-ins, NPIs, and production launches.Core strengths: embedded HW/FW (MCU/MPU, power, sensors; RTOS, Zephyr, STM32Cube, MCUXpresso, ModusToolbox); computer vision & media (YOLO, OpenCV, Whisper, Unreal Engine, real-time video/graphics); edge→cloud AI (TinyML, SageMaker, Vertex AI, MLOps/CI/CD, REST/gRPC); full-stack apps & telemetry (Python/C++, FastAPI/Flask, React/Node, MySQL/Firestore, MQTT); systems/security (sensor fusion, secure connectivity, OTA/provisioning, GDPR/CCPA). Shipped from architecture through DFM/DFT, regulatory, and mass production in the U.S./EU; inventor of Trackstick GPS and Soundlazer; builder/mentor of cross-functional teams. Dual U.S./EU citizen.

Experience

1. Senior Advanced Engineer- Edge Ai, Cloud Ai (Saas), Embedded, Mcus, Mpus & Npus

   Future Electronics

   Aug 2023 — Present · Los Angeles County, CA, US

   As an FAE and part of the Advanced Engineering Group at Future Electronics, I work directly with global and regional customers to bring cutting-edge electronic products to life using MCUs, MPUs, and embedded AI solutions. I specialize in helping customers adopt and integrate advanced semiconductor technologies from industry leaders like STMicroelectronics, Infineon, NXP, and Microchip, with a strong focus on Edge AI, sensor fusion, secure connectivity, and low-power design.I play a hands-on role across all stages of the product lifecycle—offering deep technical guidance, new product introduction (NPI) support, and system-level architecture expertise. Whether it\'s deploying AI at the edge using STM32Cube.AI or optimizing real-time control with Infineon’s PSoC Edge or NXP’s i.MX RT series, I help customers accelerate innovation from concept to production.• Supporting customer designs across Southern California and strategic global accounts• Advising on component selection, firmware architecture, and machine learning integration• Guiding Edge AI deployments with TinyML, embedded vision, and secure OTA frameworks• Driving adoption of new technologies in medical, industrial, automotive, space and IoT.Technologies & Expertise:• STM32, i.MX RT, AURIX, PSoC, SAM/AVR MCUs and MPUs.• TinyML, Edge AI, Sensor Fusion, Low-Power Wireless• Secure Bootloaders, RTOS, OTA, Zephyr, Embedded Linux• AI/ML tools: STM32Cube.AI, eIQ Toolkit, MPLAB ML, Edge Impulse• GCP, AWS IoT, Azure Edge Integration• APIs, MQTT, Mosquitto, C++, Python

Education

• Temple University

  Electrical Engineering - Technology, Electronic and Communications Engineering Technology

  1984 — 1986

• Florence Design Academy

  Industrial and Product Design, Florence, Italy

  2013 — 2014

Skills

• Visual Basic
• Video Production
• Software Development
• Post Production
• Atmel Avr
• Vmware
• Circuit Design
• Firmware
• Product Development
• 3d Printing
• Embedded Systems
• E-Commerce
• Start-Ups
• Online Advertising
• Rapid Prototyping
• Mechanical Engineering
• SEO
• Electronics
• Management
• Product Design
• Cad
• Programming
• Viral Video
• Arduino
• Digital Cinema
• Wordpress
• Film Studios
• Pcb Design
• New Business Development
• Electrical Engineering
• Kickstarter
• Web Marketing
• Solidworks
• Project Management
• Corporate Finance
• Film Production
• Engineering
• Ruby on Rails
• Viral Marketing
• Networking