Richard Perry
Manufacturing Architect at Intel
- Role
- Engineering Manager and Manufacturing Architect at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
About Richard Perry
Manufacturing Architect in the Mobile Wireless Group. He specializes in the areas of PCB technology, FEM substrate and package design, Si package design, and halogen-free product design for next-generation Intel® PRO/Wireless solutions. In January he joined Intel Corporation focusing on the wireless technology development for PCB design and PCB assembly. From 1994 to he was employed with Ericsson, Cellular Phones Division, as a Senior Manufacturing Engineer and an Operations Engineering Manager for digital phone manufacturing Specialties: HDI PCB Technology, RF Front End Module Development, LTCC package design, CMOS Package Design, Organica Substrates, RF Shield Design, Laptop Add-in Card Form factor development, Package Solder Joint Reliability(SJR), RF Passive Design, Wireless Test, HVM SMT Assembly
Experience
Engineering Manager and Manufacturing Architect
Jan 2000 — Present · Hillsboro, OR, US
Education
Clemson University
BSEE
1990 — 1996
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