Reyzil Catalan
Product Engineering Manager @Aion Silicon
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WORK HISTORY
Product Engineering Manager @Aion Silicon
London, GB
Leading silicon operations from tapeout through to volume production, covering packaging, test, collaboration with assembly and test partners, and coordination with foundry partners. I am responsible for delivering New Product Introduction programmes, driving yield improvement initiatives and developing reliability strategies in line with JEDEC standards, while ensuring customers are kept informed with clear and timely updates.Acting as the main customer contact for packaging and test deliverables, qualification reports and failure analysis. Internally, I work across engineering, architecture, operations and commercial teams to align priorities and ensure manufacturing readiness, enabling smooth product ramps and on-time milestone delivery.Alongside these responsibilities, I contribute on an ad-hoc basis to strengthening the company’s Quality Management System, supporting ISO 9001 and ISO 27001 audit readiness, documentation improvements and cross-team process alignment. I also provide regular reporting to senior leadership on risks and operational status, while mentoring engineers in structured root cause analysis, data-driven problem solving and product engineering practice.Through this combination of technical leadership, customer engagement and process improvement, I help ensure Aion’s silicon programmes transition efficiently from design into reliable, manufacturable products.
EDUCATION
Wesleyan University - Philippines
Bachelor of Science - BS, Electrical, Electronics and Communications Engineering
SKILLS
ABOUT REYZIL CATALAN
Product Engineering Manager with end-to-end semiconductor experience spanning tapeout, fab coordination, OSAT engagement, packaging, test, and quality management. I lead silicon operations across the full lifecycle — from manufacturing readiness and qualification planning through yield ramp, reliability testing, and post-silicon customer support.Skilled at building cross-functional alignment between architecture, design, engineering, operations, and commercial teams, ensure NPI projects hit customer requirements, milestones, and cost targets. Successfully defined and executed JEDEC-aligned qualification plans, driven yield improvement programs, and supported advanced package technology introductions.Lead Quality Management System (ISO 9001/27001) readiness, manage customer audits, and implement data-driven workflows for reliability, failure analysis, and continuous improvement.Passionate about bridging design and manufacturing to deliver robust, production-ready semiconductor products — and about scaling processes, teams, and supplier partnerships to support growth at the next level.
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