Reynold Dsa

Corporate Vice President, Silicon, Cloud Hardware, and Infrastructure Engineering at Microsoft

Role
Corporate Vice President, Silicon, Cloud Hardware, and Infrastructure Engineering at Microsoft
Location
Redmond, WA, US
LinkedIn followers
500 followers
General Business & ManagementView LinkedIn profile

About Reynold Dsa

Senior technology executive with 25+ years of experience in building and nurturing global multidisciplinary engineering organizations. Primarily focused on product development strategy and transforming the portfolio for growth and scale with extensive experience in business strategy, general management and operations.Energetic leader passionate about driving an engineering culture of product and process innovations, a growth mindset and adaptability to changing business needs: • Transformed the team’s culture to build for scale. Re-strategized and re-structured for a new product development model, operationalized processes and structures, and embraced LEAN thinking. • Directed investments in system level innovations that launched new market categories to extend the computing experiences. • Leveraged baseline investments to grow the business in adjacent markets Hold 15 patents in computer system architecture.

Experience

  1. Corporate Vice President, Silicon, Cloud Hardware, and Infrastructure Engineering

    Microsoft

    Apr 2021 — Present · WA, US

    Leads a global engineering organization to architect, develop and manufacture silicon, hardware server systems and infrastructure that powers Microsoft\'s Azure Cloud

Education

  • Oklahoma State University

    Bachelor's Degree, Computer Engineering

    1986 — 1990

  • Cornell University

    Master of Engineering (MEng), Computer Engineering

    1990 — 1991

  • Stanford University

    Executive Accelerator Program, Executive Leadership

    2014 — 2014

Skills

  • Fpga
  • Asic
  • Perl
  • Analog
  • Embedded Systems
  • Eda
  • Algorithms
  • Virtual Teams
  • System Architecture
  • Processors
  • Engineering Management
  • Integrated Circuits (Ic)
  • Application-Specific Integrated Circuits (Asic)
  • System on a Chip (Soc)
  • Rtl Design
  • Ic
  • Product Management
  • Microprocessors
  • Cross-Functional Team Leadership
  • Digital Signal Processors
  • Marketing Strategy
  • Mixed Signal
  • Semiconductors
  • Leadership
  • Computer Architecture
  • Semiconductor Industry
  • Strategic Leadership
  • Soc

Find verified contacts for anyone on LinkedIn

Unifers gives sales teams verified emails and direct dials, enriched profiles, and outreach that lands in the inbox.

Free plan included · No credit card required

This profile is compiled from publicly available professional sources. Unifers is not affiliated with or endorsed by LinkedIn. Request removal of this profile.

Reynold Dsa — Corporate Vice President, Silicon, Cloud Hardware, and Infrastructure Engineering at Microsoft in Redmond, WA, US | Unifers