Reagan Burkemper

About Reagan Burkemper

I am a junior Computer Engineering student minoring in Data Science and Electrical Engineering at the Milwaukee School of Engineering. My hands-on engineering experience includes an internship and numerous team-based projects. As an NCAA Division 3 Student-Athlete in Women’s Soccer, I dedicate 20-25 hours weekly to the sport alongside a full class load I\'m also active in AI Club (research group), Competitive Computing Club (cybersecurity focus), and High-Powered Rocketry Club. Skills in: C, Java, Python, VHDL, PCB Board Design, Altium, Quartus, NI Multisim, 3-D Printing, and Soldering. I am seeking a full-time internship and can be contacted at r••••••••@gmail.com or 26••••••05. From a young age, I loved to create. Whether I was making a tinfoil robot or a box car out of my mom’s old packages, the process of innovation has always intrigued me. After a teacher convinced me to join Robotics, I joined the build and electrical sub teams and became fascinated by making things move. In one of my high school classes I had to program my own robot where I loved seeing my code in action. I was debating between electrical engineering or computer science for my major before I found computer engineering. I wanted to expand my knowledge even further on both the electrical side and the programming side which is why I am pursing the electrical engineering minor as well as the data science minor. My internship work included computer software and hardware as well as troubleshooting and resolving different challenges. I worked with Polyspace Test to create and execute tests on C code and designed a custom PCB board that was compatible with the company’s medium controller. For my personal convenience, I designed and fabricated a fingerprint scanner door lock allowing access to my room without a key. I used a fingerprint scanner connected to an Arduino Uno and measured, cut, and soldered all my wires to fit my design. Through my internship, I gained valuable experience in a professional setting where I developed strong communication as I had to orchestrate several meetings with a partnering software company to discuss mine and my groups concerns. I also worked on a team strengthening my teamwork, and collaboration skills, and I continue to improve in these areas through my team project experience at MSOE.

Experience

1. Ai Data Science Intern

   Husco

   May 2024 — Present · Waukesha, WI, US

Education

• Milwaukee School of Engineering

  Bachelor of Science - BS

  2023 — 2027