Ray Talacka
- Role
- Principal Engineer for Relibility, Technology and Yield Team at Microsoft
- Location
- Austin, TX, US
- LinkedIn followers
- 500 followers
Experience
Principal Engineer for Relibility, Technology and Yield Team
May 2022 — Present · Austin, TX, US
Principal engineer for product qualification and reliability test methodology.+ Industry recognized leader with experience working with and managing many industry partners- Reliability systems: MCC HPB family ovens, Aehr Sonoma oven, Thermo Fisher MK4 tester- Sockets: Enplas, HiCon, Plastronics, WinWay- Design House: 2Bits, Q Design, MCC, ISE, Eles, EAG- Rel House: ISE, EAG, IROC- Test Hardware: Chroma, Advantest 93K, WinWay- Foundries/OSAT: TSMC, IFS, Samsung, Amkor, TFAMD, Tessolve, ASE, GUC- Chip Suppliers: AMD, Qualcomm, Marvell, Xilinx+ Designed and developed test hardware for the Incal Sonoma and MCC HPB4-6 Burn-In oven, 93K tester and MK4 ESD system.+ Developed test software programs for HTOL, SER, LU and ESD testing with enhanced methods for thermal control and multichip monitoring.+ Defined and optimized Reliability test techniques such as High Voltage Stress and Burn-In to meet and exceed expected quality levels.+ Defined and implemented Quality and Reliability Methodology and Systems \"Cookbook\" to standardize procedures and and documentation for both internal and external product engagments.
Education
Rochester Institute of Technology
Masters of Science
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