Ahmed Rasin

Role
Packaging R & d Engineer at Intel
Location
Hillsboro, OR, US
LinkedIn followers
500 followers

About Ahmed Rasin

Engineering Group Lead in Singulation Laser module with 8+ years of combined experience…

Experience

  1. Packaging R & d Engineer

    Intel

    Jun 2021 — Present

Skills

  • Uv/Vis
  • Measurement Standards
  • Material Science
  • Carbon
  • Edx
  • Xps
  • Raman
  • Curriculum Development
  • Solar Cells
  • Tem
  • Device Characterization
  • Measurement Systems
  • Simulations
  • Solar Energy
  • Photovoltaics
  • Characterization
  • Material Characterisation
  • Electronics
  • Circuit Design
  • Sustainable Design
  • Quantum Dots
  • Quality Assurance
  • Testing
  • Optoelectronics
  • I-V
  • Electrical Machines
  • Accreditation
  • Electrical Engineering
  • Spectral Response

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Ahmed Rasin — Packaging R & d Engineer at Intel in Hillsboro, OR, US | Unifers