Ramu Bodas

Aeronautical Engineer | Specializing in Design & Simulation,CAD, FEA & Thermal Analysis | Aerospace & RF Systems | SolidWorks | ANSYS | Siemens NX

Role
Simulation Engineer at Lotus Microwave Technologies
Location
Hyderabad, TG, IN
LinkedIn followers
500 followers

About Ramu Bodas

I am an Aero-mechanical engineer. I have completed my diploma in Mechanical Engineer and…

Experience

  1. Simulation Engineer

    Lotus Microwave Technologies

    May 2025 — Present · Hyderabad, IN

    Key Responsibilities:Conducted thermal and structural simulations on RF enclosures, heat sinks, and electronic packaging.Used ANSYS Mechanical and Icepak to simulate temperature distribution, stress concentration, and airflow optimization.Interpreted key thermal metrics such as θjc (junction-to-case) and θjb (junction-to-board) to improve thermal management strategies.Assisted in material coupling analysis for multi-material assemblies to predict thermal expansion mismatches.Delivered reports and design feedback to the R&D and production teams for performance validation and optimization.Worked on thermal resistance calculations, improved airflow channels, and proposed design changes to enhance cooling efficiency.

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Ramu Bodas — Simulation Engineer at Lotus Microwave Technologies in Hyderabad, TG, IN | Unifers