Ramanand Hegde
Senior Engineer I, IC Package Design at Microchip Technology Inc.
- Role
- Engineer Ii, Ic Package Design at Microchip Technology Inc.
- Location
- Bengaluru, KA, IN
- LinkedIn followers
- 500 followers
About Ramanand Hegde
I have worked on flip chip package layout design including SERDES, DDR, PCIE and GPIO interfaces in coordinance with Signal Integrity requirements. Experience in flip chip package feasibility. Also worked on SI and PI simulations during my internship.I have work experience in Allegro package designer tool versions 16.6 and 17.4.
Experience
Engineer Ii, Ic Package Design
Nov 2020 — Present · Bengaluru, IN
Education
RNS Institute Of Technology
Bachelor of Engineering - BE
2012 — 2016
R. V. College of Engineering, Bangalore
Master of Technology - MTech
2016 — 2018
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