Ramakrishna Podishetti
Manager Packaging Engineering
- Role
- Manager Packaging Engineering at AMD
- Location
- Hyderabad, TG, IN
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
About Ramakrishna Podishetti
13 years of Experience in High Speed PCB design and IC Package design which includes Hi…
Experience
Manager Packaging Engineering
Jul 2023 — Present · Hyderabad, IN
Education
Jawaharlal Nehru Technological University
B.Tech, Electronics and Comunicaton
2001 — 2005
Find verified contacts for anyone on LinkedIn
Unifers gives sales teams verified emails and direct dials, enriched profiles, and outreach that lands in the inbox.
Free plan included · No credit card required
This profile is compiled from publicly available professional sources. Unifers is not affiliated with or endorsed by LinkedIn. Request removal of this profile.