Rakshith Reddy Mundla
Intel - R&D Engineer | UF Alumni
- Role
- Semiconductor Packaging R & d Engineer at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
About Rakshith Reddy Mundla
As a Process Engineer in Oregon Advanced Packaging at Intel Corporation since February…
Experience
Semiconductor Packaging R & d Engineer
Feb 2024 — Present · Hillsboro, OR, US
Oregon Assembly Technology Development - Module Development Engineer (Dry Etch)
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