Rajput Rajender Singh
Head Packaging development at Cipla
- Role
- Packaging Engineer at Cipla
- Location
- Mumbai, IN
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
Experience
Packaging Engineer
Jan 1990 — Present
Education
Sri Guru Nanak Dev Khalsa College (SGNDKC), Delhi
Bachelor's degree, Chemistry
1981 — 1986
GNIMS
Executive MBA
Skills
- Technology Transfer
- Packaging
- Quality System
- Validation
- Gmp
- Pharmaceutical Industry
- Product Development
- Sop
- Fda
- R&D
Find verified contacts for anyone on LinkedIn
Unifers gives sales teams verified emails and direct dials, enriched profiles, and outreach that lands in the inbox.
Free plan included · No credit card required
This profile is compiled from publicly available professional sources. Unifers is not affiliated with or endorsed by LinkedIn. Request removal of this profile.