Rajput Rajender Singh

Head Packaging development at Cipla

Role
Packaging Engineer at Cipla
Location
Mumbai, IN
LinkedIn followers
500 followers

Experience

  1. Packaging Engineer

    Cipla

    Jan 1990 — Present

Education

  • Sri Guru Nanak Dev Khalsa College (SGNDKC), Delhi

    Bachelor's degree, Chemistry

    1981 — 1986

  • GNIMS

    Executive MBA

Skills

  • Technology Transfer
  • Packaging
  • Quality System
  • Validation
  • Gmp
  • Pharmaceutical Industry
  • Product Development
  • Sop
  • Fda
  • R&D

Find verified contacts for anyone on LinkedIn

Unifers gives sales teams verified emails and direct dials, enriched profiles, and outreach that lands in the inbox.

Free plan included · No credit card required

This profile is compiled from publicly available professional sources. Unifers is not affiliated with or endorsed by LinkedIn. Request removal of this profile.

Rajput Rajender Singh — Packaging Engineer at Cipla in Mumbai, IN | Unifers