Rajib Das
Vice President | Lead TPM
- Role
- Vice President Information Technology at 摩根大通
- Location
- Hyderabad, TG, IN
- LinkedIn followers
- 500 followers
About Rajib Das
I am a Lead Technical Program Manager, with over two decades of experience in software project management, data engineering, and application development. I hold a Certified Scrum Master certification and a Sig sixma green belt, demonstrating my proficiency and excellence in agile methodologies and quality improvement. My core competencies include leading the delivery of multiple complex projects that align with the company\'s strategies and vision, collaborating with cross-functional stakeholders, bridging cultural gaps, and empowering my teams to achieve new milestones. I have a proven track record of delivering outstanding results, optimizing costs, and enhancing growth opportunities for the organizations I have worked with, including Amazon,Bank of America, Morgan Stanley, and JPMorgan Chase. I am passionate about developing and implementing innovative programs that support the strategic direction and mission of any organisation, leveraging my expertise in data engineering and analytics.
Experience
Vice President Information Technology
Nov 2023 — Present · Hyderabad, IN
TPM lead - API Marketplace India
Education
NIT Silchar
BE, Mechanical
1997 — 2001
Skills
- Extract, Transform, Load (Etl)
- Unix
- Etl
- Data Warehousing
- User Acceptance Testing
- Derivatives
- Sql
- Quality Center
- Sybase Products
- Vbscript
- Sybase
- Software Project Management
- Sdlc
- Solution Architecture
- Requirements Analysis
- Vendor Management
- Project Management
- Agile Methodologies
- Requirements Gathering
- Software Development Life Cycle (Sdlc)
- Pl/Sql
- Business Analysis
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