Raj Bishnoi
Embedded Software Engineer - Staff @TDK InvenSense
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WORK HISTORY
Embedded Software Engineer - Staff @TDK InvenSense
San Jose, CA, US
Cross-Functional Collaboration: Partnered with Algorithm, System, HW, FPGA, and Android Framework teams to develop firmware for a customized, ultra-low-cost, and low-power motion-sensing SoC.Apex Algorithm Integration: Coded, debugged, and integrated accelerometer and gyroscope algorithms (Tilt, Tap, Free Fall, Bring2See, R2W, and Bump) using native assembly on an in-house simulator with register-based debugging.Temperature Compensation Porting: Collaborated with the system team to port temperature compensation features from MATLAB/C++ test benches to optimized C and native TDK processor assembly.Hardware Profiling: Developed sensor-specific processing modules to assist the hardware team in performance profiling.Processor Evaluation: Conducted comparative performance profiling (code size and clock cycles) for sensor algorithms across ARM, RISC-V (SiFive), and TDK architectures to guide executive processor selection.
EDUCATION
Indian Institute of Technology, Guwahati
Bachelor's degree in Electronics and Communication Engineering
SKILLS
ABOUT RAJ BISHNOI
Extensive embedded firmware (FW) experience across multiple domains, including: Sensor motion technology (MEMS, IMU): 2+ years Solid State Drives (SSD): 6+ years WLAN (LMAC): 2+ years DSP audio/speech software: 8+ yearsProficient in collaborative firmware development within integrated software and hardware environments, utilizing methods such as SW/HW co-simulation, FPGA emulation, and validation on final ASIC SOCs.Experienced with firmware development in various operating systems and platforms, including QNX and Qualcomm RTOS, Android Audio FrameworkSkilled in implementing, profiling, and optimizing DSP algorithms and modules on DSP/ARM processors using both C and target-specific assembly languages to minimize code/data size and cycles.Technical Skills Languages - C, C++, MATLAB, Perl, Python, VerilogAssembly Languages - ARM (7/9TDMI, 926EJ-S, M0/M3, A53), DSP(C50/C54X/C64X(VLIW), SANYO (24 bit),MOTOROLA DSP56K (24bit), 3DSP (32bit), ADI DSP (Blackfin 16bit), NXP-Trimedia (32bit, VLIW), Tensilica, Qualcomm Hexagon)Hardware Platforms - EVM boards (ARM 7/9, TI, ADI, SANYO, 3DSP, MOTOROLA, Cadence, NXP), Conexant WLAN development platform (DP), HGST SSD AVB and FPGA prototype DP, Plantronics Headset/Headphone DP, Android mobile development platform (Qualcomm), Qualcomm Automotive Development Platform(S820) Software Packages/Tools - Microsoft Visual C++ 6.0, Eclipse IDE, Freedom Studio, MATLAB /SIMULINK, Perforce, SVN, JIRA, Cool Edit, Adobe Audition, Code Collaborator, Coverity, Omnipeek, Wireshark, Logic Analyzer and Mictor, Cadence NCSIM, Mentor Graphics Questa Sim and Synopsis RTL compiler, QNX Software Development Platform (SDP)Misc. Skills - MPEG audio (MP3, AAC, Dolby Digital, Digital audio Post Processing), ALSA, Codec Driver, Audio Pipeline, Speech Codec, WLAN (802.11), SSD (NAND Flash), Windows8 driver, Linux Driver, ADB, DMA, I2C, SPI, UART, GPIO, STB, AXI and BVCI interconnect, AMBA, Qualcomm proprietary RTOS, Promira (Total Phase) I2C | SPI tools, J-link tools.
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