Rahul Suresh Nair

Research Assistant @Institute Faps

Nuremberg, DE

At the intersection of material science and power electronics, I investigate how epoxy mold compounds (EMC) bond to the many surfaces found in modern SiC MOSFET power modules and how this interface affects long-term reliability using modern ML and CV analysis algorithms for better segmentations and deep insights.Responsibilities & Key ContributionsQuantitative adhesion benchmarking• Measured and compared pull-/shear-strength of EMC on Cu, Al, Ni, Ag, Au, TiAg braze, polyimide, ceramic (Al₂O₃, AlN, Si₃N₄) and polymer frame materials.• Evaluated oxide-layer thickness/composition to identify optimum Cu/Cu₂O/CuO ratios for robust bonding.Advanced image & signal analytics• Built an automated pipeline (ImageJ + OpenCV) to segment SEM micrographs and SAM C-scan stacks, extracting void content, crack length and interfacial roughness.• Processed time-resolved SAM frequency data with Python (pandas, NumPy), matplotlib & seaborn, enabling statistical lifetime models and interactive dashboards.Computer-aided engineering & reliability• Performed thermo-mechanical FEA in ANSYS to link local adhesion energy to package warpage and stress hotspots.• Designed and executed AEC-Q324-aligned power-/temperature-cycle tests for SiC half-bridge modules; correlated failure modes with EMC adhesion metrics.Technology comparison & design guidance• Benchmarked EMC adhesion against soldering, Ag-sintering, laser welding and AMB/DCB Cu-ceramic joining, recommending interface selections for ≥ 30 k cycle reliability.• Delivered material–process design rules (surface prep, oxide control, roughness targets) for next-gen automotive traction inverters.Skills: ImageJ • OpenCV • Python (pandas, matplotlib, seaborn) • ANSYS Mechanical • SEM / SAM • Power-module assembly (die attach, clip bonding, AMB/DCB) • Statistical data analysis • Materials science & reliability engineering.

College of Engineering Trivandrum

Bachelor of Technology - BTech

FAU Erlangen-Nürnberg

Master of Science - MS, Electromechanical Technology/Electromechanical Engineering Technology