Rahul Shukla

Lead Engineer @TransUnion

Chicago, IL, US
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WORK HISTORY

Jan 2021 — Present

Lead Engineer @TransUnion

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Chicago, IL, US

EDUCATION

2018 — 2020

University of Illinois Chicago

Master of Science-MIS, Management Information Systems, General

2008 — 2012

Kanpur Institute of Technology

Bachelor of Technology (B.Tech.), Electronics and Communication engineering

N/A

The University of Chicago Booth School of Business

Master of Business Administration - MBA

ABOUT RAHUL SHUKLA

Engineer, product builder, and founder working on high-stakes AI problems.At TransUnion, I’m responsible for key modernization initiatives across AWS-to-GCP migration, application upgrades, and resilient data pipelines. I partner across engineering and product to improve reliability, data quality, and customer outcomes at scale.Outside my day role, I’m building MediBill Copilot, an AI copilot to help patients challenge incorrect medical bills, identify potential FDCPA issues, and respond to abusive debt collection practices. I work across product strategy, user experience, and implementation, including a multi-agent RAG system with human-in-the-loop controls for high-stakes decision support.I’m especially interested in applied AI, fintech infrastructure, and products that materially improve people’s lives. Open to connecting with founders, PMs, and engineers working on hard problems.

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