Pratik Motwani
Advanced Packaging Engineering Manager - Photolithography and be Thin Films (Barrier Seed) @Intel
Signup · Get unlimited contacts
WORK HISTORY
Advanced Packaging Engineering Manager - Photolithography and be Thin Films (Barrier Seed) @Intel
Hillsboro, OR, US
EDUCATION
Sardar Patel University
Bachelor of Engineering (BEng), Electrical, Electronics and Communications Engineering
University of Houston
Doctor of Philosophy (PhD), Nanofabrication
SKILLS
ABOUT PRATIK MOTWANI
10+ years of experience in Fabrication techniques10+ years of experience working with various characterization techniques like SEM, EDS, AFM, TEM, CDSEM.10+ years of experience working as an Equipment Engineer (Dual-magnetron sputter,PECVD, Atom beam lithography,RIE) and Lab manager for a sq.ft. research center and LEO 1525 SEM microscope (FE-SEM), EDS.Summary of Skills:• Expertise in thin film deposition – Both PVD (Physical vapor deposition) and CVD (Chemical vapor deposition), iCVD (Conformal coating of polymer resist materials), ALD, SAMs, MRIE, Proximity lithography (ions and neutrals), chemical etching and handling, Semiconductor Device Physics, NAND Flash technology, NVM, RCA. • Advanced knowledge and expertise in the following softwares and programming languages : LABVIEW,SILVACO,LINUX,CADENCE/CALP,VIRTUOSO,PSPICE,HSPICE,MATLAB,WIRESHARK,PYTHON,SRIM,TRIM,VHDL,VERILOG,C,C++,VISIO,SOLIDWORKS,LATEX,MS OFFICE and programming and configuration of CISCO routers. • Various characterization techniques: CV, 4-point probe, HALL Effect, High resolution SEM, Energy dispersive spectrometry, Ellipsometry, Alpha step profilometer, Raman mapping using Line-scan Raman spectroscopy, AFM, XRD, TEM• Experience with working in SPC and DOE.
This profile is compiled from publicly available professional sources. Unifers is not affiliated with or endorsed by LinkedIn. Request removal of this profile.